International Exhibition Center about ACROSSER

ACROSSER Technology announces our participation in 2013 the Embedded Systems Expo and Conference (ESEC) from May 8th to the 10th. The event will take place at the Tokyo International Exhibition Center in Tokyo, Japan. We warmly invite all customers to come and meet us at the west hall, booth number: WEST 10-61.Contact：
http://www.acrosser.com/inquiry.html

The embedded computer future is active

The embedded computer future is active

At the Fleck Connection Congress, Intersil's embedded computer elaborated on active cable interconnects as a way to address many of the challenges. In active cables, small silicon ICs are embedded in each end. The silicon restores signals that have been attenuated over the length of the cable. Active copper-based cables can be used for the lowest cost and lowest power applications while active optical fiber-based cables are ideal for the longest distances. Data centers are already embracing active cables to overcome embedded computer of existing solutions. The consumer embedded computer is more cost sensitive and thus more hesitant to use active cables, but the driving need for ultra-thin product profiles and I/O density are making active cables the only option.

refer to: http://vita-technologies.com/articles/connect-trends-challenges-solutions-advancing-performance/

The embedded Analog Front End (AFE) as a new device

The ubiquitous use of sensors in our embedded smart devices – from cell phones to industrial equipment and even medical devices – has increased the need for more intelligent sensor technologies that are more versatile, lower overall costs, and require fewer resources to develop and maintain.

However, Many of today's embedded systems incorporate multiple analog sensors that make devices more intelligent, and provide users with an array of information resulting in improved efficiency or added convenience. The Analog Front End (AFE), allowing the connection of the sensor to the digital world of the MCU, is often an assumed "burden" in designing sensor interface circuits. However, the latest concept in a configurable AFE, integrated into a single package, is helping systems designers overcome sensor integration challenges associated with tuning and sensor drift, thereby reducing time to market. The following embedded discussion examines how the versatility of such a technology allows the designer to tune and debug AFE characteristics on the fly, automate trimming and adjust for sensor drift, and add scalability to support multiple sensor types with a single platform.

refer to: http://embedded-computing.com/articles/latest-afe-simplifies-interfacing-hundreds-sensors/#at_pco=cfd-1.0

Rich meal on open source market with embedded techniques

Embedded platform distributions – To eat or not eat?

Evaluating options, refining the OSS palate

Finding potentially useful code represents only half the challenge. Developers must also vet discovered code across a variety of parameters to determine if it is technically and legally viable. Factors to consider include code size, language, and quality; community history and dynamics; software licensing; and provenance.

Code size – Legacy embedded designs face severe constraints on code size. While tumbling DRAM and flash memory prices have made parsimonious provisioning a concern of the past, embedded software still benefits from compact code. Memory and storage eaten up by utility and infrastructure code are unavailable for differentiating software and for end-user content.

Because OSS starts with source code, the memory footprint of a given project or softwarecomponent isn’t always obvious. Moreover, today’s device-based software stacks can contain ingredients cooked up in traditional compiled/assembled languages (C, C++, assembly), byte-code executed Java, and scripted/interpreted languages (PHP, Python, Lua, and so on).

refer to: http://embedded-computing.com/articles/eating-open-source-buffet/#at_pco=cfd-1.0