New feature for power management

Qseven supports power management features embedded computer and requires only a 5 V power supply, making it well suited for battery-run applications. Recent embedded computer updates to the specification also introduced a reduced form factor module and extended support for mobile processors, increasing the specification’s viability for low-power, portable applications.

“If it is a mobile application with low to medium computing performance requirements, then Qseven is the right choice,” says Christian Eder, Marketing Manager at congatec AG headquartered in Deggendorf, Germany (www.congatec.com). “Medical systems typically require special functionalities such as ultrasonic control or high levels of isolation in order to protect patients in case of a malfunction. Standard SBCs typically do not feature that. The embedded computer logical consequence is to create a custom carrier board that takes all specific functionalities and complete it with a standard COM. Once this combination is certified, it is quite easy to upgrade or scale to other CPUs while the certification remains or just needs to be updated. This provides a lot of freedom to choose the best-fitting CPU and graphics for a given application.”

refer to: http://smallformfactors.com/articles/qseven-coms-healthcare-mobile/

Wi-Fi applications availability among industry

An upcoming industry-standard specification that defines an interoperable mechanism for reliable, point-to-point HD video transmission between two Wi-Fi-enabled devices is expected from the in-vehicle in the second half of 2012. Although video over Wi-Fi applications have been available for quite some time, this is the industry’s first attempt to develop an interoperability specification for video distribution. s to IVI systems is instrumental in providing an optimal end-user experience. lose proximity or touch. To ensure this seamless transfer of information between the mobile and automotive ecosystems, in-vehicle manufacturers must leverage standards-based technology that in-vehicle enables consumers to carry any phone into any car and transfer data wirelessly. time, this is the industry’s first attempt to develop an interoperability specification for video distribution. s to IVI systems is instrumental in providing an optimal end-user experience. lose proximity or touch.

refer to: http://embedded-computing.com/articles/wireless-accelerate-next-wave-in-vehicle-innovation/

Threats you should be aware of

“One of the biggest threats is the administrative threat, caused by vulnerabilities related to having a super user or super password that can access every file,” he says. “Industry and government are moving away from super users due to leaks that have occurred. If that super user or super password is compromised embedded computer, every piece of data in a system is vulnerable. At SafeNet we assume someone is bound to get in, so we work at encrypting each object so even when they get in they can’t wreak havoc with the data. The more granular you drive the encryption, the less exposure your data will have to malicious attacks.”

refer to : http://mil-embedded.com/articles/cloud-security-the-dod/

10 GbE technology enables a standard solution

Virtualization trends in commercial computing offer benefits for cost, reliability, and security, but pose a challenge for military operators who need to visualize lossless imagery in real time. 10 GbE technology enables a standard zero client solution for viewing pixel-perfect C4ISR sensor and graphics information with near zero interactive latency.

For C4ISR systems, ready access to and sharing of visual information at any operator position can increase situational awareness and mission effectiveness. Operators utilize multiple information sources including computers and camera feeds, as well as high-fidelity radar and sonar imagery. Deterministic real-time interaction with remote computers and sensors is required to shorten decision loops and enable rapid actions. A zero client represents the smallest hardware footprint available for manned positions in a distributed computing environment. Zero clients provide user access to remote computers through a networked remote desktop connection or virtual desktop infrastructure. Utilizing a 10 GbE media network for interconnecting multiple computers, sensors, and clients provides the real-time performance and image quality required for critical visualization operations. The cost of deploying a 10 GbE infrastructure is falling rapidly and 10G/40G has become the baseline for data center server interconnect. Additionally, deploying common multifunction crew-station equipment at all operator positions brings system-level cost and logistics benefits. The following discussion examines the evolution to thinner clients and the path to a real-time service-oriented architecture, in addition to looking at zero client benefits and applications.

.....

refer to : http://mil-embedded.com/articles/10-real-time-remote-desktops-c4isr/#utm_source=Cloud%2Bmenu&utm_medium=text%2Blink&utm_campaign=articles

International Exhibition Center about ACROSSER

ACROSSER Technology announces our participation in 2013 the Embedded Systems Expo and Conference (ESEC) from May 8th to the 10th. The event will take place at the Tokyo International Exhibition Center in Tokyo, Japan. We warmly invite all customers to come and meet us at the west hall, booth number: WEST 10-61.Contact：
http://www.acrosser.com/inquiry.html

The embedded computer future is active

The embedded computer future is active

At the Fleck Connection Congress, Intersil's embedded computer elaborated on active cable interconnects as a way to address many of the challenges. In active cables, small silicon ICs are embedded in each end. The silicon restores signals that have been attenuated over the length of the cable. Active copper-based cables can be used for the lowest cost and lowest power applications while active optical fiber-based cables are ideal for the longest distances. Data centers are already embracing active cables to overcome embedded computer of existing solutions. The consumer embedded computer is more cost sensitive and thus more hesitant to use active cables, but the driving need for ultra-thin product profiles and I/O density are making active cables the only option.

refer to: http://vita-technologies.com/articles/connect-trends-challenges-solutions-advancing-performance/

Rich meal on open source market with embedded techniques

Embedded platform distributions – To eat or not eat?

Evaluating options, refining the OSS palate

Finding potentially useful code represents only half the challenge. Developers must also vet discovered code across a variety of parameters to determine if it is technically and legally viable. Factors to consider include code size, language, and quality; community history and dynamics; software licensing; and provenance.

Code size – Legacy embedded designs face severe constraints on code size. While tumbling DRAM and flash memory prices have made parsimonious provisioning a concern of the past, embedded software still benefits from compact code. Memory and storage eaten up by utility and infrastructure code are unavailable for differentiating software and for end-user content.

Because OSS starts with source code, the memory footprint of a given project or softwarecomponent isn’t always obvious. Moreover, today’s device-based software stacks can contain ingredients cooked up in traditional compiled/assembled languages (C, C++, assembly), byte-code executed Java, and scripted/interpreted languages (PHP, Python, Lua, and so on).

refer to: http://embedded-computing.com/articles/eating-open-source-buffet/#at_pco=cfd-1.0

How about dimension in operating systems?..

Given the increased complexity of processors and applications, the current generation of Operating Systems (OSs) focuses mostly on software integrity while partially neglecting the need to extract maximum performance out of the existing hardware.

Processors perform as well as OSs allow them to. A computing platform, embedded or otherwise, consists of not only physical resources – memory, CPU cores, peripherals, and buses – managed with some success by resource partitioning (virtualization), but also performance resources such as CPU cycles, clock speed, memory and I/O bandwidth, and main/cache memory space. These resources are managed by ancient methods like priority or time slices or not managed at all. As a result, processors are underutilized and consume too much energy, robbing them of their true performance potential.
1.An advanced performance management solution
2.Extending to more dimensions
3.Implementation on VMX Linux
4.Benchmarks show the results
refer:
http://embedded-computing.com/articles/performance-management-new-dimension-operating-systems/

Embedded industry M2M

Machine-to-Machine (M2M) communications strategies and cloud computing are transforming industrial interconnects from an assortment of fragmented, proprietary technologies to open standards easily integrated into new designs. This new direction in M2M connectivity enables a wide range of applications and services by exchanging real-time data between remote devices, one or more central servers, and authorized third parties.

M2M technology allows embedded design teams to contain costs, improve security, enable remote management, and maximize system availability. The major goal of M2M communications is to combine real-time data from remote devices with enterprise applications to automate everyday company decisions and thus optimize industrial output and lower operating costs.

In this issue of Industrial Embedded Systems, we asked contributors to take a look at the networking, sensing, and computing issues affecting embedded design for industrial applications. For example, Mike Ueland, senior VP and general manager at Telit Wireless Solutions North America, describes the benefits and cost savings associated with M2M connections for remotely monitoring and managing assets. Mike outlines several good reasons to support an M2M industrial application based on cellular technology. In an in-depth interview covering intelligent networking technologies, Tom Barber, director of marketing at Silicon Labs, presents a new wireless microcontrollerproduct that fulfills the requirements of embedded applications with RF connectivity. Tom also highlights the new capabilities offered in low-power mesh networks resulting from Silicon Labs’ acquisition of Ember Corporation. Expanding the discussion, Shaye Shayegani, senior field applications engineer at Lantronix, answers questions on the security and adaptability of industrial networking modules. Shaye addresses the major connectivity challenges that industrial customers are dealing with right now.

Changing the subject to the sensitivity and stability of brushless DC motors in industrial applications, Honeywell Sensing and Control’s Joshua Edberg, senior global marketing manager in the Magnetic Sensors division, and Fred Hintz, engineering manager in the Speed and Position Sensors division, dispel three myths of chopper stabilization techniques. Covering another topic essential to factory settings, Karim Wassef, director of DC-DC product line management at GE Energy’s Power Electronics division, answers questions about the power sources available to operate in hostile conditions such as extended temperatures or corrosive environments. In a software-related topic, Doug Jones and Brian McKay, marketing managers at MathWorks, cover the advantages Model-Based Design offers for complex industrial control systems, allowing users to simulate, test, and debug circuitry before committing it to hardware.

refer:
http://industrial-embedded.com/articles/embedded-upgrades-m2m-networks/

To survive and prosper in the competitive atmosphere

 

To survive and prosper in the competitive atmosphere of today’s embedded industry, designers are constantly developing and testing new ideas and innovations that can enable smaller, faster, lower-power, and lower-cost devices while achieving faster time to market. One of our objectives this month was to identify and recognize a few of these innovative products along with the prominent innovators who are changing our industry.
In response to the promotion for this inaugural Innovation Issue, we received dozens of suggestions and entries specializing in our main topics of coverage: Silicon, Software, and Strategies. Although it was a difficult choice, our editorial team evaluated nominees and selected three winners based on creativity, uniqueness, and value to the embedded community. As you can see on the cover, the winners of the 2012 Embedded Computing Design award for Top Embedded Innovator are:

• Silicon: Zvi Or-Bach, founder and CEO of MonolithIC 3D, for breakthrough techniques that enable the fabrication of 3D semiconductor devices using conventional fabrication equipment.
• Software: Sebastien Marineau-Mes, Senior VP of Engineering at QNX Software Systems, for advances in embedded automotive technology, mobile operating systems, and open-source development tools.
• Strategies: Kwok Wu, Head of Embedded Software and Systems Solutions atFreescale Semiconductor, for networking and communications innovations that connect users and smart devices.

In addition to the innovation coverage, this issue is loaded with new ideas and technologies you can use in your embedded design projects. For example, in the Silicon section, Alex Lin of Advantech shows how the transition to multicore processing platforms is revolutionizing embedded computing design by removing many traditional constraints. Recognizing how multicore delivers new capabilities and improvements to performance, power consumption, and cost, Debbie Greenstreet and Atul Verma from the Multicore Processors Business Unit at Texas Instruments issue a call to action for the industry to establish a market-accepted multicore benchmarking strategy that benefits not only embedded engineers, but multicore System-on-Chip(SoC) manufacturers as well. Presenting a key technology at the center of multicore-based mobile devices, Intel’s Max Domeika demonstrates how HTML5 can help solve two of the biggest problems in embedded design: application portability and performance.

The transition to multicore has made a significant impact on the software development side of embedded design. In this issue’s Software section, Brad Quinton from the Tektronix EmbeddedInstrumentation Group outlines techniques to simplify the on-chip instrumentation and debug process for ASICs and FPGAs with increasing complexity. Continuing the debug theme, Frank Schirrmeister, Michael McNamara, Larry Melling, and Neeti Bhatnagar of Cadence Design Systems describe the best methods to observe and evaluate the significant software/hardware dependencies present in the latest generation of intricate electronic systems. Emphasizing the need for software developers to interact with hardware earlier in the design process, Colin Walls of Mentor Graphics Embedded Software Division explains how an integrated embedded platform offers greater visibility into hardware and software execution threads and enables more efficient debug.

Focusing on the rising popularity of In-Vehicle Infotainment (IVI) applications, this month’s Strategies section presents some of the latest technologies that help enhance system usability and safety. Scott Pennock of QNX Software Systems discusses how spatial auditory displays can improve human-machine interaction and serve as an enabling technology for new in-vehicle applications. In addition, Marvell Semiconductor’s Bart Giordano examines the impact of wirelesstechnologies such as Bluetooth, Wi-Fi, and Near Field Communication (NFC)on current IVI designs and the next generation of vehicle-to-vehicle communications systems.

The embedded industry is constantly changing as new innovations such as those revealed in this issue are implemented and integrated into the latest devices and applications. We are working hard to keep you up-to-date with the most recent trends and technologies essential to your embedded design projects. If you would like to present your innovation to the embedded industry with a technical article or video, please send me a suggestion or an abstract.

Refer:
http://embedded-computing.com/articles/creative-innovations-reshape-embedded-environment/

Acrosser technology Booth in 2013 embedded world Exhibition&Conference

The embedded world Exhibition&Conference is the world's biggest exhibition of its kind and the meeting-place of the international embedded community. Embedded technologies are in action everywhere - whether in the car, data and telecommunication systems, industrial and consumer electronics, military systems or aerospace. 872 exhibitors showed 22,262 qualified visitors the full range of products for embedded technologies in 2012: hardware, software, tools, services and lots more.

Embedded world, the biggest and most important event of its kind, opens the series of high-tech exhibitions and knowledge-packed events at the Nürnberg venue from 26–28 February 2013. This event sets standards and records every year – now for the eleventh time in 2013. Exhibitors from all over the world present the entire spectrum of embedded systems: hardware, software, tools and services.
Acrosser ------> Booth Hall 2 2-519

refer:
http://www.embedded-world.de/en/press/

COM Express Type 6 pin-out design ACM-B6360

ACM-B6360 is base on COM Express Type 6 pin-out design and supports two DDR3-1333 SO-DIMM socket with ECC and four native USB 3.0 ports. Working with Acrosser evaluation basboard ACM-B4080. It provides not only speed and but also reliability. Moreover, two SATA 3.0, two SATA 2.0, four USB 3.0, four USB 2.0, one GbE and I2C, SMBus interface are integrated on them. Even with great computing and graphic performance, the optimized power design delivers high power efficiency and decrease system heat.

 

Key features:
1. COM Express Basic Type 6 Module with Fan heatsink
2. Onboard Intel 3rd Generation Core i7-3615QE BGA processor.
3. Two DDR3 SO-DIMM sockets with ECC supportted, up to 16G
4. Supports 3 independent display output
5. 1 x PCI-E x16 Gen.3, 7x PCI-E x1 interfaces
6. 2 x SATAIII ports, 2 x SATAII ports
7. 4 x USB 3.0 ports, 4 x USB 2.0 ports
8. 1 x GbE, I2C, SMBus, LPC interface

The AR-R6006 carrys Intel ATOM dual-core D525 processor

The platforms is equipped with six Intel PCI express Gigabit Ethernet controllers. Its advanced features include 802.1p (QoS), 802.1q (VLAN), IPv4 and IPv6 checksum offload, auto MDI-X, up to 256 KB TCP segmentation, ACPI power saving control and 9 KB Jumbo Frame support. Customers can benefit much higher communication performance from AR-R6006.

AR-R6006 is a rackmount platform designed for Networking Application, which can be installed in the 19” rack. Both of the platforms offer the best cost/performance ratio in applications like the UTM, IDS/IPS, VPN, Firewall, Anti-Virus/Spam, RSA gateway, QoS, streaming. 

The AR-R6006 carrys Intel ATOM dual-core D525 processor which supports Hyper Threading Technology and Intel 64 architecture with low power consumption. Enhanced low-power states allow designers to further minimize overall power consumption. They can deliver more efficient use of processor resources, higher processing throughput and improved performance on applications.

Key features:
‧ 1U Rack Mount chassis
‧ Low power Intel ATOM D525 Dual Core processor 1.8 GHz+ ICH8M
‧ Two DDR3 SO-DIMM support up to 4GB (unbuffered and non-ECC dimm)
‧ 6 x Intel 82574L GbE Ethernet with 2 pair LAN Bypass Function
‧ 1 x 2.5”/3.5” SATA HDD Bay, 1 x CF Type II socket
‧ 2 x USB 2.0 ports in front
‧ 1 x Mini-PCI slot, 1 x RJ45 for Console

The Great AR-V6005 and AR-V6100 in 2012

Both Acrosser In-Vehicle PC, AR-V6100 & AR-V6005 have been selected as the winner of 21th Taiwan Excellence Award.

 

 

 AR-V6005FL is equipped with Intel Atom E640 processor and Intel EG20T PCH chipset for low power consumption and entry-level vehicle applications. Not only with standard industrial PC I/O interfaces such as VGA/DVI display, Ethernet, USB, WiFi, Bluetooth, and RS-232/485, AR-V6005FL also features intelligent power management, CAN bus, Digital I/O, i-Button (One Wire), GPS, Bluetooth, WiFi and 3.5G GSM for in-vehicle applications. 

 

 AR-V6100FL is the fanless system features powerful 45W Intel Core i7 technology. AR-V6100FL adopts Acrosser’s expertise of design for in-vehicle applications. These designs include smart power management, high efficient thermal module, and diversity of integrated communication technology such as CAN bus, Wi-Fi, 3.5G GSM, Bluetooth and GPS.

Rackmount AR-R8601E16 with VIA Eden Chipset

The AR-R8601 has low power consumption which meets global environmental friendly trend. The unit support up to 1GB DDR2 system memory at 400MHz, by leveraging the 3 PCI onboard 10/100 Fast Ethernet which is perfect for general small office UTM function. With a low speed system fan, the system has stable performance with minimal noise.
AR-R8601 offers a best hardware platform for applications such as VoIP application,  UTM (Unified Threat Management), WAS (Web Access Management), VPN and Anti-Spam mail solution in small office. System integrators can easily develop their internet security solutions with this x86 platform.

Single board computer ,Console server ,Panel PC

1. VIA Eden 1.6Ghz
2. 1U Rackmount Networking platform
3. 3 x 10/100 LAN
4. CF,USB 2.0
5. Support Console Function
6. Power effective

AR-ES5231FL fanless system design reduces failures due to CPU and systems fans

Fanless and Dustproof Intel 910GMLE Celeron M 1GHz/600MHz Embedded System

AR-ES5231FL ’s fanless design reduces failures due to CPU and systems fans, thus increasing the product life and reliability significantly. Its PCI-104 expansion slot provides many options for all kinds of 104 modules to meet specific project needs.
support for Windows XP, XP embedded and Windows CE, Linux allows flexibility. 1~255 seconds software programmable watch dog timer can wake system from unexpected failures and save technical service loads.

 

http://www.acrosser.com/News-Press-Release/37.html

Console server ACS-R1000/1001 Fanless Rackmount with Celeron/Pentium Chipset

Acrosser Technology, Co., LTD today is introducing two models of the Console Server, ACS-R1000 and ACS-R1001. Our console servers are for remote access and control of serial devices, such as servers and routers, from anywhere, at anytime. In addition, Acrosser has added new features including ESD 15KV for industrial purpose using serious environment.
The ACS-R1000 series ranging from 8 to 16-port models is to meet the management needs of any IT environment. The new ACS-R1000/R1001 support 8/16 COMs and include 6 10/100/1000 Base-T Ethernet ports.

Because ACS-R1000/R1001 controls IT devices through their serial ports, IT specialists can use the secure console server to monitor and manage any connected devices, even when the network is down. And because it is IP-based, administrators can security access the console using a secure web browser or SSH(secure shell) client. With access to remote servers and other IT devices available from anywhere, administrators can resolve incidents and problems more quickly, reducing downtime and IT equipment management costs.

Singleboard Industrial,Console server,Panel PC

features:
* Fanless 1U rack mount from 0~50℃
* With Intel mobile CPU, it can support Celeron M 1.5GHz, Pentium M 1.6GHz/1.8GHz
* Onboard 512MB DDRII and one SO-DIMM socket up to 1GB, total RAM can be 1.512GB
* 6 x 10/100/1000Mbps
* 3-in-1 serial port with selectable RS-232, RS-422, and RS-485
* With modulated, it can be upgrade 16xCOMs with easy setting RS-232/422/485
* Compact Flash type II with UDMA support
* Support SATA HDD
* Watchdog timer: software programmable 1~255 seconds
* Isolation Protection
       ˙2KV Vrms isolation
       ˙8mm Isolation boundary area which can support SELV(the Safety Extra-Low Voltage)
* Built-in 15KV ESD Surge Protection for all serial signals
* One Console port
* Two USBs, VGA Port

Fanless Single board AR-B8172 with Vortex86DX 800MHz & 256MB DDR2

AR-B8172, a new ISA half-size CPU board with DM&P Vortex86DX 800MHz SoC and 256MB DDRII memory.

Legacy ISA Supporting

AR-B8172 has legacy PC/104 interface that through ISA Bus by Vortex86DX. It doesn’t need a bridge chip to transfer PCI signal to ISA signal. It has good compatibility with the older carrier board, motion card or IO card. By true ISA supporting, it can replace the older or phased-out CPU platform like Ali or STPC. Those CPU are hard to buy and the cost is raised. AR-B8172 will be a nice alternative platform to develop.

Low Power Consumption Solution

AR-B8172 is equipped with Vortex86DX is a low power consumption platform. Vortex86DX’s power consumption is 2~3 Watts and the total power consumption of AR-B8172 under full-loading near 6 Watts. AR-B8172 also offers VGA output, two serial ports and four USB for basic IO requirement. AR-B8172 will be an ideal solution for embedded application which need lower CPU performance and less IO in harsh environment.

1. Fanless Design
2. Onboard DM&P Vortex86DX 800MHz
3. Onboard 256MB DDR2 SDRAM
4. IDE, CF
5. PC/104 Interface
6. 2 x COM, 4 x USB2.0, VGA, 1 x 10/100 LAN

Embedded System AR-ES6003FL with Intel Atom D525/D425 chipset

AR-ES6003FL
Fanless and Dustproof Intel Atom D525/D425 Embedded System with PCI and PCIe Expansion Slot

Embedded Computer

1. Support Intel Atom D525 (Dual Core) and D425 (Single Core)
2. 2 x DDR3 SO-DIMM, up to 4GB
3. Selectable PCI & PCI Express x1 Expansion Slot
4. mini-PCIe Expansion Slot
5. Use JST connectors and switch to avoid cables drop
6. Support Win XP, 7, Fedora 14 and Ubuntju 10

Console Server with Intel Pentium /Celeron ACS-N5230FL

ACS-N5230FL
8/12 Serial Ports Fanless and Dustproof Intel 915GME Pentium /Celeron M Console Server with 8 Isolation

Console server