How about dimension in operating systems?..

Given the increased complexity of processors and applications, the current generation of Operating Systems (OSs) focuses mostly on software integrity while partially neglecting the need to extract maximum performance out of the existing hardware.

Processors perform as well as OSs allow them to. A computing platform, embedded or otherwise, consists of not only physical resources – memory, CPU cores, peripherals, and buses – managed with some success by resource partitioning (virtualization), but also performance resources such as CPU cycles, clock speed, memory and I/O bandwidth, and main/cache memory space. These resources are managed by ancient methods like priority or time slices or not managed at all. As a result, processors are underutilized and consume too much energy, robbing them of their true performance potential.
1.An advanced performance management solution
2.Extending to more dimensions
3.Implementation on VMX Linux
4.Benchmarks show the results
refer:
http://embedded-computing.com/articles/performance-management-new-dimension-operating-systems/

Embedded industry M2M

Machine-to-Machine (M2M) communications strategies and cloud computing are transforming industrial interconnects from an assortment of fragmented, proprietary technologies to open standards easily integrated into new designs. This new direction in M2M connectivity enables a wide range of applications and services by exchanging real-time data between remote devices, one or more central servers, and authorized third parties.

M2M technology allows embedded design teams to contain costs, improve security, enable remote management, and maximize system availability. The major goal of M2M communications is to combine real-time data from remote devices with enterprise applications to automate everyday company decisions and thus optimize industrial output and lower operating costs.

In this issue of Industrial Embedded Systems, we asked contributors to take a look at the networking, sensing, and computing issues affecting embedded design for industrial applications. For example, Mike Ueland, senior VP and general manager at Telit Wireless Solutions North America, describes the benefits and cost savings associated with M2M connections for remotely monitoring and managing assets. Mike outlines several good reasons to support an M2M industrial application based on cellular technology. In an in-depth interview covering intelligent networking technologies, Tom Barber, director of marketing at Silicon Labs, presents a new wireless microcontrollerproduct that fulfills the requirements of embedded applications with RF connectivity. Tom also highlights the new capabilities offered in low-power mesh networks resulting from Silicon Labs’ acquisition of Ember Corporation. Expanding the discussion, Shaye Shayegani, senior field applications engineer at Lantronix, answers questions on the security and adaptability of industrial networking modules. Shaye addresses the major connectivity challenges that industrial customers are dealing with right now.

Changing the subject to the sensitivity and stability of brushless DC motors in industrial applications, Honeywell Sensing and Control’s Joshua Edberg, senior global marketing manager in the Magnetic Sensors division, and Fred Hintz, engineering manager in the Speed and Position Sensors division, dispel three myths of chopper stabilization techniques. Covering another topic essential to factory settings, Karim Wassef, director of DC-DC product line management at GE Energy’s Power Electronics division, answers questions about the power sources available to operate in hostile conditions such as extended temperatures or corrosive environments. In a software-related topic, Doug Jones and Brian McKay, marketing managers at MathWorks, cover the advantages Model-Based Design offers for complex industrial control systems, allowing users to simulate, test, and debug circuitry before committing it to hardware.

refer:
http://industrial-embedded.com/articles/embedded-upgrades-m2m-networks/

To survive and prosper in the competitive atmosphere

 

To survive and prosper in the competitive atmosphere of today’s embedded industry, designers are constantly developing and testing new ideas and innovations that can enable smaller, faster, lower-power, and lower-cost devices while achieving faster time to market. One of our objectives this month was to identify and recognize a few of these innovative products along with the prominent innovators who are changing our industry.
In response to the promotion for this inaugural Innovation Issue, we received dozens of suggestions and entries specializing in our main topics of coverage: Silicon, Software, and Strategies. Although it was a difficult choice, our editorial team evaluated nominees and selected three winners based on creativity, uniqueness, and value to the embedded community. As you can see on the cover, the winners of the 2012 Embedded Computing Design award for Top Embedded Innovator are:

• Silicon: Zvi Or-Bach, founder and CEO of MonolithIC 3D, for breakthrough techniques that enable the fabrication of 3D semiconductor devices using conventional fabrication equipment.
• Software: Sebastien Marineau-Mes, Senior VP of Engineering at QNX Software Systems, for advances in embedded automotive technology, mobile operating systems, and open-source development tools.
• Strategies: Kwok Wu, Head of Embedded Software and Systems Solutions atFreescale Semiconductor, for networking and communications innovations that connect users and smart devices.

In addition to the innovation coverage, this issue is loaded with new ideas and technologies you can use in your embedded design projects. For example, in the Silicon section, Alex Lin of Advantech shows how the transition to multicore processing platforms is revolutionizing embedded computing design by removing many traditional constraints. Recognizing how multicore delivers new capabilities and improvements to performance, power consumption, and cost, Debbie Greenstreet and Atul Verma from the Multicore Processors Business Unit at Texas Instruments issue a call to action for the industry to establish a market-accepted multicore benchmarking strategy that benefits not only embedded engineers, but multicore System-on-Chip(SoC) manufacturers as well. Presenting a key technology at the center of multicore-based mobile devices, Intel’s Max Domeika demonstrates how HTML5 can help solve two of the biggest problems in embedded design: application portability and performance.

The transition to multicore has made a significant impact on the software development side of embedded design. In this issue’s Software section, Brad Quinton from the Tektronix EmbeddedInstrumentation Group outlines techniques to simplify the on-chip instrumentation and debug process for ASICs and FPGAs with increasing complexity. Continuing the debug theme, Frank Schirrmeister, Michael McNamara, Larry Melling, and Neeti Bhatnagar of Cadence Design Systems describe the best methods to observe and evaluate the significant software/hardware dependencies present in the latest generation of intricate electronic systems. Emphasizing the need for software developers to interact with hardware earlier in the design process, Colin Walls of Mentor Graphics Embedded Software Division explains how an integrated embedded platform offers greater visibility into hardware and software execution threads and enables more efficient debug.

Focusing on the rising popularity of In-Vehicle Infotainment (IVI) applications, this month’s Strategies section presents some of the latest technologies that help enhance system usability and safety. Scott Pennock of QNX Software Systems discusses how spatial auditory displays can improve human-machine interaction and serve as an enabling technology for new in-vehicle applications. In addition, Marvell Semiconductor’s Bart Giordano examines the impact of wirelesstechnologies such as Bluetooth, Wi-Fi, and Near Field Communication (NFC)on current IVI designs and the next generation of vehicle-to-vehicle communications systems.

The embedded industry is constantly changing as new innovations such as those revealed in this issue are implemented and integrated into the latest devices and applications. We are working hard to keep you up-to-date with the most recent trends and technologies essential to your embedded design projects. If you would like to present your innovation to the embedded industry with a technical article or video, please send me a suggestion or an abstract.

Refer:
http://embedded-computing.com/articles/creative-innovations-reshape-embedded-environment/

Acrosser technology Booth in 2013 embedded world Exhibition&Conference

The embedded world Exhibition&Conference is the world's biggest exhibition of its kind and the meeting-place of the international embedded community. Embedded technologies are in action everywhere - whether in the car, data and telecommunication systems, industrial and consumer electronics, military systems or aerospace. 872 exhibitors showed 22,262 qualified visitors the full range of products for embedded technologies in 2012: hardware, software, tools, services and lots more.

Embedded world, the biggest and most important event of its kind, opens the series of high-tech exhibitions and knowledge-packed events at the Nürnberg venue from 26–28 February 2013. This event sets standards and records every year – now for the eleventh time in 2013. Exhibitors from all over the world present the entire spectrum of embedded systems: hardware, software, tools and services.
Acrosser ------> Booth Hall 2 2-519

refer:
http://www.embedded-world.de/en/press/

COM Express Type 6 pin-out design ACM-B6360

ACM-B6360 is base on COM Express Type 6 pin-out design and supports two DDR3-1333 SO-DIMM socket with ECC and four native USB 3.0 ports. Working with Acrosser evaluation basboard ACM-B4080. It provides not only speed and but also reliability. Moreover, two SATA 3.0, two SATA 2.0, four USB 3.0, four USB 2.0, one GbE and I2C, SMBus interface are integrated on them. Even with great computing and graphic performance, the optimized power design delivers high power efficiency and decrease system heat.

 

Key features:
1. COM Express Basic Type 6 Module with Fan heatsink
2. Onboard Intel 3rd Generation Core i7-3615QE BGA processor.
3. Two DDR3 SO-DIMM sockets with ECC supportted, up to 16G
4. Supports 3 independent display output
5. 1 x PCI-E x16 Gen.3, 7x PCI-E x1 interfaces
6. 2 x SATAIII ports, 2 x SATAII ports
7. 4 x USB 3.0 ports, 4 x USB 2.0 ports
8. 1 x GbE, I2C, SMBus, LPC interface

The AR-R6006 carrys Intel ATOM dual-core D525 processor

The platforms is equipped with six Intel PCI express Gigabit Ethernet controllers. Its advanced features include 802.1p (QoS), 802.1q (VLAN), IPv4 and IPv6 checksum offload, auto MDI-X, up to 256 KB TCP segmentation, ACPI power saving control and 9 KB Jumbo Frame support. Customers can benefit much higher communication performance from AR-R6006.

AR-R6006 is a rackmount platform designed for Networking Application, which can be installed in the 19” rack. Both of the platforms offer the best cost/performance ratio in applications like the UTM, IDS/IPS, VPN, Firewall, Anti-Virus/Spam, RSA gateway, QoS, streaming. 

The AR-R6006 carrys Intel ATOM dual-core D525 processor which supports Hyper Threading Technology and Intel 64 architecture with low power consumption. Enhanced low-power states allow designers to further minimize overall power consumption. They can deliver more efficient use of processor resources, higher processing throughput and improved performance on applications.

Key features:
‧ 1U Rack Mount chassis
‧ Low power Intel ATOM D525 Dual Core processor 1.8 GHz+ ICH8M
‧ Two DDR3 SO-DIMM support up to 4GB (unbuffered and non-ECC dimm)
‧ 6 x Intel 82574L GbE Ethernet with 2 pair LAN Bypass Function
‧ 1 x 2.5”/3.5” SATA HDD Bay, 1 x CF Type II socket
‧ 2 x USB 2.0 ports in front
‧ 1 x Mini-PCI slot, 1 x RJ45 for Console

The Great AR-V6005 and AR-V6100 in 2012

Both Acrosser In-Vehicle PC, AR-V6100 & AR-V6005 have been selected as the winner of 21th Taiwan Excellence Award.

 

 

 AR-V6005FL is equipped with Intel Atom E640 processor and Intel EG20T PCH chipset for low power consumption and entry-level vehicle applications. Not only with standard industrial PC I/O interfaces such as VGA/DVI display, Ethernet, USB, WiFi, Bluetooth, and RS-232/485, AR-V6005FL also features intelligent power management, CAN bus, Digital I/O, i-Button (One Wire), GPS, Bluetooth, WiFi and 3.5G GSM for in-vehicle applications. 

 

 AR-V6100FL is the fanless system features powerful 45W Intel Core i7 technology. AR-V6100FL adopts Acrosser’s expertise of design for in-vehicle applications. These designs include smart power management, high efficient thermal module, and diversity of integrated communication technology such as CAN bus, Wi-Fi, 3.5G GSM, Bluetooth and GPS.